Ph.D. trained scientist delivering yield improvement, defect reduction, and process scalability in semiconductor manufacturing. Skilled in RIE plasma and wet etching optimization, and DOE/SPC-driven process improvements for high-volume production. I combine advanced chemistry expertise with hands-on engineering to develop high-performance, production ready solutions. I optimized RIE plasma etching (CF₄, O₂, Ar) by fine-tuning gas composition, RF power, and chamber parameters, and enhanced wet etch flow dynamics to achieve a 10% improvement in panel etch uniformity. My work spans electroless copper deposition for TGV substrates, in-depth defect analysis using TEM/FIB-SEM, and DOE/SPC-driven process optimization for high-volume manufacturing.  

Core Skills Semiconductor & Materials Processes - 

1. RIE plasma etching (13.56 MHz , 40 kHz downstream) with mixed gas chemistry 

2. Wet etching of glass (TGV) using alkaline based etchant and ABF substrates with uniformity and defect control improvements

 3. Electroless copper deposition including surface functionalization and activation protocols 

4. Thin film deposition and adhesion testing via peel and cross-hatch methods  

Process Control & Optimization - 

1. Advanced DOE and SPC for yield improvement, cost reduction, and repeatability in production 

2. PFMEA, Fishbone, 5 Whys, and 8D root cause analysis 

3. Developed 20+ process recipes and SOPs from R&D to HVM scale  

Failure Analysis & Characterization- 

1. FIB-SEM, TEM, EDS, AFM, XPS, 3D mapping, confocal/optical microscopy, ICP-MS, UV-Vis, FT-IR, NMR, GC-MS 

2. Imaging, spectroscopy, and statistical data review for defect identification and mitigation  

Data & Software Proficiency- 

1. JMP (DOE & SPC), MATLAB, Python (basic), Gaussian, ORCA, Mnova 

2. Technical reporting, data visualization, and stakeholder presentations  

Soft Skills - Problem solving, Customer Interface, cross-functional collaboration, stakeholder alignment, and project leadership